dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

• 骰子;色子
  Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
• 掷骰子游戏
  Diceis a game which is played using dice.
• VERB 把(食物)切成小块;将…切丁
  If youdicefood, you cut it into small cubes.
  1. Dice the onion...
     把洋葱切成丁。
  2. Add the crushed garlic and remaining diced vegetables.
     加入捣碎的大蒜和剩余的蔬菜丁。

双语例句

• Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized.
  通常情况下，剥离速度和切割速度都是很低的。基于其本身的能力来讲，激光器没有运行在最优化的状态下。
• Introduces the development of semiconductor industry, the characteristic of laser wafer dicing technology, the structure of laser wafer dicing machine, and the application in the production.
  介绍了半导体行业的发展，晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。
• Freddy Krueger plays the vengeful monster who kills by slicing, dicing and chopping people who had murdered him.
  弗雷迪·克鲁格扮演一个复仇的魔鬼，他把那些杀害他的人一一肢解至死。
• Design and Implementation of Primary and Secondary Schools Admission Dicing System Based on Proximity Principle
  基于就近原则的中小学招生划片系统设计与实现
• After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
  通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
• Development of Conductive Photopolymer Resin Bond Dicing Blade
  导电性光固化树脂结合剂锯片的研制
• The secondary advantages can include a significant reduction of labor costs, as no post visual inspection is needed as in traditional dicing processes.
  第二大优点包括，降低了人工费用，不需要常规的后续视觉检测。
• In OLAP processing, slicing and dicing is often performed along a time axis to analyze trends and find time-based patterns in the data.
  在OLAP的加工，切片和切割往往是演出沿着时间轴来分析发展趋势，并抽出时间为基础的模式中的数据。
• The Technology Study on UV Laser Dicing High Brightness LED Wafer
  高亮度LED晶圆紫外激光划片技术研究
• Dicing area can be washed by water directly and easily be cleaned up.
  切菜区域可直接用水冲刷，清洗方便。